The 22nd China International High-Tech Fair, themed 'Technology Changes Life, Innovation Drives Development,' was held from November 11 to 15 at the Shenzhen Convention and Exhibition Center. The fair gathers innovative resources, promoting the integration of domestic and international high-tech industries. It serves as a crucial platform for showcasing high-tech products, facilitating technology transfer, and fostering open cooperation within the field. This year's fair featured both offline and online exhibitions, with 24 countries and 29 international organizations participating offline, while 30 provincial and municipal delegations and 27 university delegations took part.
The Longgang District delegation at this High-Tech Fair boasts a strong lineup, with universities, research institutions, and enterprises all making appearances. The exhibition area showcases achievements from academic institutes and high-end innovation talent teams, along with cutting-edge products from leading companies in integrated circuits, biomedicine, intelligent manufacturing, computer software, and electronics. The integrated circuits section, featuring high-tech products from star companies like Xintianxia Technology, stands out as a highlight, attracting keen attention from participating leaders, guests, and media friends.
XTX Technology's cutting-edge products on display
Shenzhen XTX Technology Co., Ltd. (hereinafter referred to as 'XTX') is dedicated to becoming an outstanding general-purpose chip design company, currently focusing on the design of code-type storage products. Code-type storage devices are crucial for ensuring the stability of product system code in the Internet of Things era and serve as the medium for data storage, updates, and security in the big data era for intelligent terminals. XTX showcased three series of core products this time.
1.SPI NOR Flash Low Power Series
Wide capacity range: 1.8V/Wide 2Mb-128Mb;
• Product features: low power consumption, high reliability; supports up to 105°C high temperature;
• Various package options: available in DFN6 2x3, DFN8 4x3, DFN8 4x4, WSON8 5x6, SOP8 150mil, and SOP8 208mil, among others, for customer selection; particularly, the DFN6 1.2x1.2x0.4mm is the smallest packaged SPI NOR Flash product globally;
• Broad application areas: Internet of Things, smart wearables, touch and display, communication, etc.
2.SPI NOR Flash Large Capacity Series
Typical product representative: 3V/Wide 256Mb SPI NOR Flash;
Product features: large capacity, high reliability;
Various package forms: WSON8 6x8, SOP16 300mil;
Broad application areas: smart security, communication, industrial control, etc.
3.SLC NAND Product series
Capacity: 1Gb-8Gb;
• Product forms include: Parallel NAND, SPI NAND, NANDMCP, SD NAND;
• Packaging forms: Parallel NAND products come in TSOP48 & BGA24, SPI NAND products come in WSON8 6x8, BGA24, SD NAND comes in LGA8 6x8mm;
• Application areas: smart homes, wireless communication, routers, gateways, intelligent security, etc.
Welcome all customers to choose our core products from XTX.
Contact information for our professional sales and technical service team:
• Sales support: salesteam@xtxtech.com;
• Technical support: fae@xtxtech.com;
• Additional technical support: ae@xtxtech.com;
• Programmer manufacturer support: fae@xtxtech.com.
Dedicated to becoming an outstanding general-purpose chip design company
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