XTX Packaging Background
With the development of chip packaging technology, semiconductor packaging has evolved from pin-insertion packages like DIP and SOP to surface-mount packages like DFN and BGA, and further to wafer-level packages like WLCSP. At the same time, with the rapid advancement of consumer electronics such as smart wearables, chip packaging technology faces challenges and opportunities for higher integration, miniaturization, and upgraded connection processes.
In response to market opportunities, XTX introduced one of the smallest DFN packages (1.2*1.2*0.4mm) in the industry at the right time. They have not stopped exploring more advanced packaging technologies. As WLCSP packaging technology continues to mature within the industry, XTX began integrating WLCSP packaging in 2020 and has passed comprehensive evaluations. They plan to officially launch 1.8V 64Mb & 128Mb WLCSP packages in Q1 2021, with plans to gradually introduce a full range of WLCSP packages to meet customer needs.
XTX WLCSP Roadmap 
Features of XMT WLCSP products
WLCSP (Wafer Level Chip Scale Packaging) is a chip-scale packaging at the wafer level, representing the smallest possible package size for integrated circuits. Its advantages include:
(1) Small external dimensions: The projected area after packaging is equivalent to the size of the bare chip, achieving a 1:1 ratio between the package size and the chip size;
(2) Excellent electrical performance: Compared to traditional wire bonding, WLCSP has shorter internal leads, significantly improving signal integrity;
(3) High reliability: It eliminates delamination issues introduced by frames and molding, providing good thermal dissipation. It also meets JEDEC MSL-1 (Moisture Sensitivity Level-1) requirements;
(4) Strong compatibility: Compatible with industry-standard WLCSP packages, allowing hardware pin-to-pin replacement.
| Product Model | Performance support |
|
XT25Q64DWLIGT
 XT25Q64DLCIGT  |
Function：
|
|
XT25Q128DWLIGT  |
Function：
|
The application areas of WLCSP are very extensive, mainly involving smart wearables, including smartwatches, bracelets, head-mounted devices, TWS markets, etc.
I. Smart glasses
II. Wireless earbuds
III. Smart heart rate wristband
Mass production support
| Product Model | Encapsulation | Supply Information |
|
XT25Q64DWLIGT XT25Q64DLCIGT |
WLCSP 12 Ball WLCSP 12 Ball |
Q2’21Bulk supply |
| XT25Q128DWLIGT | WLCSP 21 Ball | Q2’21Bulk supply |
Contact information
For on-site support and inquiries, please email fae@xtxtech.com;
For sales support and inquiries, please email sales@xtxtech.com;
To learn more about our products, visit our website at http://www.xtxtech.com.
